ICC1 @ Max.frequency, CL33. mobile function

• PASR : Partial Array Self Refresh
• TCSR : Temperature Compensated Self Refresh
• DS : Drive Strength Control

4. current

• ICC6 @ Low, Full Bank, 85°C / 70°C

5. lead-free & halogen-free package

• K4XXXXXXXX-XXXXX (Xth code represents a package)

2 : 90FBGA (DDP)
3 : 90FBGA (lead-free & halogen-free, DDP)
4 : 96FBGA
5 : 96FBGA (lead-free & halogen-free)
7 : 90FBGA
8 : 90FBGA (lead-free & halogen-free)
A : 168FBGA (lead-free, halogen-free, DDP)
F : 60FBGA (lead-free & halogen-free)
M : 152FBGA (lead-free & halogen-free, POP)
N : 168FBGA (lead-free & halogen-free, POP)
P : 60FBGA (lead-free & halogen-free, DDP)
Y : 60FBGA (DDP)

 Mobile DRAM

High-speed, power-saving memory for the next generation of mobile devices

Find out why leading manufacturers utilize Mobile DRAM for eBooks, tablet computers, smart phones, MP3s, and PDAs. Deliver the features you need to confidently meet market demand for handheld devices with high-performance memory built specifically for the leading edge of mobile device and application design.

Gain exceptional design advantages

Benefits of using Mobile DRAM in computing, consumer, and communication devices include:

• Reduced power consumption in standby mode enabled by advanced, on-chip technologies such as temperature-compensated self-refresh (TCSR)
• Extended battery life in operational mode with power consumption as low as 1.2V
• High operational speeds that keep pace with today´s fast mobile CPUs and large displays, enabling users to power through demanding applications and multitasking
• Design flexibility with a choice of thin, small form-factor packages that occupy very little board space

Realize outstanding power savings

Boost battery life with new generations of Samsungmobile memory:

• Samsungis introducing the world´s first 30-nm class LPDDR3 for high peak bandwidth and outstanding energy efficiency
• Samsungs’ 20-nm class LPDDR2 is designed to deliver significant power savings compared to the previous-generation LPDDR1 - while heightening performance to bring full, high-definition viewing to virtually any mobile device.
• Gain additional power savings by moving from a dual-die package to a monolithic chip, keeping the same total density, enabling an overall improvement of up to 70 percent in power efficiency at the component level.

Our LPDDR2 and LPDDR3 are designed to extend the life of a seven-hour battery by about 45 minutes during typical mobile operation. For standby power, the savings are even more dramatic. For example, Samsungs LPDDR2 or LPDDR3 can add up to three days of standby battery life for a smart phone, which is a 23 percent improvement over LPDDR1 - from 12.5 to 15.4 days.

MCP

Samsung Multi-Chip Packages

Innovative "chip-stack" design optimizes board space

Find out why leading manufacturers choose SamsungMulti-Chip Packages (MCPs) for applications where board space is extremely limited, such as smartphones and other mobile handsets, tablets, and multimedia players. MCP memory configurations are designed to support a growing list of device capabilities, expanding freedom and choice for users who want to do more with their mobile applications.

Unify memory technologies on a single substrate

SamsungMCPs combine different memory technologies, including single-level cell (SLC) NAND flash or eMMC and Mobile DRAM such as LPDDR1 (low-power DDR1) and LPDDR2 on a single substrate. This flexible approach is designed to deliver benefits including:

• Enhanced memory and overall system performance through tight coupling and close positioning of memory modules to establish the shortest interconnections possible in a small, high-density package
• Average 30 percent to 40 percent savings in board space for your end product through the stacking of several memory chips in a vertical configuration
• Minimized bill-of-materials count for simplified manufacturing and cost savings
• Accelerated time to market through rapid integration of MCP modules, speeding the pace of product development

The broad Samsung MCP portfolio includes a myriad of memory configurations, primarily with 2-, 3-, or 4-die packages. The most popular combinations are 1Gb+512Mb; 2Gb+1Gb; 4Gb+2Gb (NAND and Mobile DRAM); as well as new eMMC-based MCP (eMCP) combos such as 4GB eMMC + 4Gb MDDR, and 32GB eMMC + 8Gb LPDDR2. The newest-generation eMCP modules are designed to contain a combination of the fastest eMMC (embedded multimedia card), along with either MDDR or LPDDR2 memory.